SikaBond®-58 Wood Floor

USAGE

SikaBond®-58 Wood Floor is designed for full surface bonding of solid and engineered wood floors and ply boards.

Advantages

• Adhesive can be sanded
• Floors can be sanded after 12 hours
• Elastic, footfall-sound dampening properties
• Suitable for use with underfloor heating
• Very low emissions
• Reduces stress transfer between the wood floor and the substrate
• Good bead stability
• Good workability and plasticity
• Low VOC content

COMPOSITION

Polyurethane

SHELF LIFE

SikaBond®-58 Wood Floor has a shelf life of 9 months from the date of production, if it is stored properly in undamaged, original, sealed packaging, and if the storage conditions are met.

STORAGE CONDITIONS

SikaBond®-58 Wood Floor shall be stored in dry conditions, protected from direct sunlight and at temperatures between +5 °C and +25 °C.

DENSITY

1.30 kg/l approx.(ISO 1183-1)

SAG FLOW

SikaBond®-58 Wood Floor spreads very easily whilst maintaining stable trowel marks.

AMBIENT AIR TEMPERATURE

+15 °C to +35 °C

RELATIVE AIR HUMIDITY

40% to 70%

SUBSTRATE TEMPERATURE

During laying and until SikaBond®-58 Wood Floor has fully cured, the substrate and ambient temperatures shall be between +15 °C and +35 °C without and between +20 °C and +35 °C with underfloor heating.

SUBSTRATE MOISTURE CONTENT

Permissible substrate moisture content without underfloor heating:

• 2.5% CM for cement screeds. (ca. ~4% Tramex / Gravimetric weight percent)
• 0.5% CM for anhydrite screeds.
• 3–12% CM for magnetite flooring (depending on the organic content).

Permissible substrate moisture content for use with underfloor heating:

• 1.8% CM for cement screeds. (ca. ~3% Tramex / Gravimetric weight percent)
• 0.3% CM for anhydrite screeds.
• 3–12% CM for magnetite flooring (depending on the organic content).

Note: For all moisture contents, the quality of the substrates and surfaces, always follow the guidelines of the wood flooring manufacturer.

CURING RATE

4.5 mm/24 hours approx. (23 °C / 50% r.h.)

TACK FREE TIME

60 minutes approx. (23 °C / 50 % r.h.)

Download Sikabond_-58 Woodfloor Product Data Sheet

Download Sikabond 58 Wood Floor SDS